This paper analyzes the common selection idea in the hot melt adhesive industry that "selecting wax with a melting point of 130℃ can shorten the curing time". It clarifies that the dropping melting point of industrialized mass-produced conventional non-oxidized polyethylene wax generally does not exceed 120℃, and points out that forcibly pursuing the melting point of 130℃ will cause secondary problems such as decreased compatibility and thermal aging of the adhesive. At the same time, it explains that oxidized wax is not suitable for this scenario due to its excessively high viscosity. This paper introduces the mature commercial application status of hot melt adhesive special polypropylene wax with both high melting point and low viscosity, and also gives an alternative scheme that can optimize the curing speed without replacing the wax category, providing a practical technical reference for the formulation selection of hot melt adhesives.
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